Mounting system for highly integrated and caseless components, mounted on printed circuit boards.

摘要

In the case of components having high power losses and more than 500 pins, conventional cooling possibilities are no longer adequate. In addition, installation is problematic. In order to solve this problem, the invention provides that the components (4) are connected to the associated solder lands (17) on the printed-circuit board (9) via flat spiders (7). A membrane (2) which forms a border around the component (4) and is attached to its surface is connected at its other end to a cooling sheet (11), which likewise runs all round above the component (14) and makes good thermally-conductive contact with a cold plate (1). A cooling fluid is located in the cavity (10) which is in consequence produced.