| 摘要 |
A specially designed electronic component is surface mounted on a printed circuit board substrate member having a spaced series of electrically conductive circuitry connection portions disposed on a side surface thereof. The electronic component has a body portion with a spaced series of elongated metal lead members fixedly secured thereto and projecting outwardly therefrom. Longitudinal portions of the lead members are soldered to the circuitry connection portions. Side surface areas of these longitudinal portions are clad with a second metal material having a coefficient of thermal expansion substantially different than that of the underlying longitudinal lead member portions. During fabrication of the circuit board a solder paste material is deposited on the circuitry connection portions and the lead member longitudinal portions are placed in a closely adjacent, aligned relationship with the circuitry connection portions. A conventional reflow process is then used to solder the lead members to the circuitry portions. Upon receipt of the soldering heat the longitudinal portions of the bimetal lead member structures are thermally deflected toward the circuitry connection portions, thereby automatically compensating for misalignments between the longitudinal lead member portions and the circuitry connection portions. |
