| 摘要 |
<p>PURPOSE:To provide a method by which it is possible to eliminate the bad effects of impurity ions contained in the electroplating liquid on a board and to positively mount the electronic component on the solder plated part, in a method of mounting electronic components by soldering them by heating the solder plated part after the electronic component is mounted on the solder plated part. CONSTITUTION:Without carrying out fusing, the electronic component 5 is mounted after coating the flux 7 mixed with ion trapping material on the flat surface of the solder plated part 4, and the solder plated part 4 is heated and melted as it is, thereby soldering the electrode part 6 of the electronic component 5. Because of this, since no fusing is carried out, the surface of the solder plated part 4 remains flat and hence the electronic component mounted on it does not slip off. Further, since the impurity ions exuded from the solder plated part 4 are captured by the ion trapping material, it is possible to avoid corrosion of the substrate 1 and to eliminate migration.</p> |
