发明名称 MOLD APPARATUS
摘要 PURPOSE:To reduce the weld mark, thickness reduction and strain generated when a long synthetic resin molded product is molded by providing a required number of molten resin supply ports to a female mold at required positions and providing control plates moving up and down around the supply ports to the female mold. CONSTITUTION:A molten resin 3 is supplied into a mold apparatus 1 from a supply port 8 by upper and lower drive means 5, 5 and guided by control plates 4, 4 to be spread in an almost oval shape. After the molten resin is spread to the end part of a female mold 2, the upper and lower drive means 5, 5 are driven to allow the control plates 4, 4 to fall and the molten resin is cooled and solidified to mold a synthetic resin molded product. By raising the control plates 4, 4 by again driving the upper and lower drive means 5, 5, the synthetic resin molded product is raised. By this constitution, the number of supply ports can be reduced as compared with a conventional mold apparatus and, therefore, the weld mark generatd when the synthetic molded product is molded can be reduced.
申请公布号 JPH079454(A) 申请公布日期 1995.01.13
申请号 JP19930180027 申请日期 1993.06.24
申请人 HOSOKAWA SEISAKUSHO:KK 发明人 HOSOKAWA TOSHIHIRO;ISHITSUBO RIYUUICHI
分类号 B29C33/42;B29C43/34;B29C43/36;B29C45/00;B29C45/27;B29C45/56;B29L7/00;(IPC1-7):B29C33/42 主分类号 B29C33/42
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