| 摘要 |
A smart card comprises a printed circuit 11 sandwiched between outer protective layers 37 and 38 with intervening layers of reinforcing material 39 and 40, typically of a material such as polyester. During fabrication an integrated circuit component 19 on the card deforms the reinforcing material 39 and embeds itself in protective layer 37 which is softened during the manufacturing process. Once fabricated the reinforcing layer 39 prevents the component 19 "breaking out" of the outer protective layer.The reinforcing layers 39, 40 are coated on both sides with a thermally activated catalytic curing adhesive which bonds the protective layers to the printed circuit 11 and the outer protective layers 37, 38. <IMAGE> |
