| 摘要 |
PURPOSE: To enable crossover connection, to dispense with the formation of a large number of metalization layers or vias and to enable interconnection between chips in multi-chip modules or packages by forming two or more wire- bond connections to a common metallic trace formed on a substrate. CONSTITUTION: When it is desired to form a interconnection between pads 116a and 118a and between pads 116c and 118a, a 1st wire bond 128a connects the pad 116a to a trace 126c. A 2nd wire bond 128b connects a pad 118b to the trace 126c. A 3rd wire bond 128c connects the pad 116c to a trace 126e. A 4th wire bond 128d connects the pad 118a to the trace 126e. Thus, the wire bond 128b is vertically separated, just by a distance 132a and is not in contact with the trace bond 126e. The wire bond 128c is separated just by a distance 132b which is not in contact with the trace 126c, so that crossing is enabled. |
