Radiation sensitive adhesive composition and method of photoimagingsame

摘要

A method of photodelineating an adhesive on a substrate. The first step (10) is to coat the substrate with a layer of photopolymeric adhesive, typically spin coated. The adhesive is then briefly 'soft baked' at a moderate temperature to set it (20). Portions of the adhesive are then selectively exposed to actinic radiation to partially cure them, while other portions are not exposed (30). A photomask is used to selectively expose the photopolymeric adhesive to ultraviolet light at an intensity and for a time sufficient to partially cure the photopolymeric adhesive. The adhesive is developed (40) to selectively remove those portions that were not exposed to radiation, usually in an appropriate solvent, creating a pattern in the adhesive. The developed adhesive pattern is then heated for a time and temperature sufficient to completely cure it (50).