| 摘要 |
PURPOSE:To provide a highly reliable product, which can prevent the deformation of a lead frame, by easing the residual stress caused by heating in wire bonding and the like. CONSTITUTION:In a multilayered lead frame, a plurality of the layers of a signal layer, a power supply layer, a grounding layer and the like are laminated so as to hold an insulating film 7 having electrical insulation property between the layers. Of bonding agents 8 and 9 provide on both surfaces of the insulating frame in the lead frame, the bonding agent 8, which is applied on one surface for bonding the layer that undergoes wire bonding, uses a material, whose Young's modulus at the wire temperature becomes E=1.0X10<8>dyne/cm<2> or larger. The bonding agent 9 applied on the other surface of the above described insulating film 7 uses a material whose Young's modulus becomes E=1.0X10<6> dyne/cm<2> or smaller. |
