| 摘要 |
<p>PURPOSE:To improve breakdown voltage by smoothing punched areas on the underside of the element mount surface of a lead frame, and thereby allowing potting material to creep to the underside. CONSTITUTION:Optical transmissive resin 105, such as silicone resin, is potted on the upper side of beds 101a and 102a. Thus the beds 101a and 101b, a luminous element 103, a light receiving element 104, and a gap between the beds 101a and 102a are integrally sealed with the optical transmissive resin 105. After filling the gap between the beds 101a and 102a, the optical transmissive resin 105 extends to the underside of the beds 101a and 102a. As a result, the creeping distance W1 of the lower part of the optical transmissive resin 105 is approx. 1.7mm, approx. 1.5 times WO. Creeping distance of optical transmissive resin in a gap between beds is increased as mentioned above; therefore, breakdown voltage is improved without degradation in photoconductivity.</p> |
