| 发明名称 |
High-density packaging for multiple removable electronics subassemblies. |
| 摘要 |
<p>Packaging for an electronics assembly. A base card (200) has a row of elongated slots (221). A number of individually insertable subassemblies (300) have standoff feet and a pair of offset hooks at their sides. The hooks snap into the slots in such a way that each slot can hold the hooks for four different subassemblies, which are positioned adjacent each other and on both sides of the base card. <IMAGE></p> |
| 申请公布号 |
EP0630174(A1) |
申请公布日期 |
1994.12.21 |
| 申请号 |
EP19940480044 |
申请日期 |
1994.05.25 |
| 申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
BLOCK, TIMOTHY ROY;GAIO, DAVID PETER;SODERSTROM, RONALD LEE |
| 分类号 |
H05K1/14;G02B6/42;G02B6/44;H01R12/70;H05K3/36;H05K7/14;(IPC1-7):H05K7/14 |
主分类号 |
H05K1/14 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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