发明名称 Semiconductor device with a gettering sink material layer
摘要 Silicon substrate is provided with silicon single-crystalline wafer, natural oxide film and poly-crystalline silicon film. The thickness of natural oxide film is controlled to be less than 10 ANGSTROM . Since the thickness of natural oxide film is made less than 10 ANGSTROM , heavy metals travel smoothly from silicon single-crystalline wafer to poly-crystalline silicon film in the process of gettering. In other words, it is possible to enhance gettering effect.
申请公布号 US5374842(A) 申请公布日期 1994.12.20
申请号 US19930020080 申请日期 1993.02.19
申请人 MITSUBISHI DENKI KABUSHIKI KAISHA 发明人 KUSAKABE, KENJI
分类号 H01L21/322;(IPC1-7):H01L21/322 主分类号 H01L21/322
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