发明名称 |
Electronic packaging apparatus. |
摘要 |
<p>Electronic components (18) such as chips are attracted to the tip ends of nozzles (15a - 15b) under suction, and mounted on printed-circuit boards (29) when the vacuum condition in the nozzles is broken. The time for breaking the vacuum condition in the nozzles (15a - 15b) is adjusted by a variable time adjusting unit (44) based on angular displacement information of a cam (25) which vertically moves the nozzles (15a - 15b) depending on the selected mounting cycle. Even when a different mounting cycle is selected, time delays are varied to adjust the time for breaking the vacuum condition in the nozzles (15a - 15b) for thereby mounting electronic components (18) accurately and stably on printed-circuit boards (29). <IMAGE></p> |
申请公布号 |
EP0627877(A1) |
申请公布日期 |
1994.12.07 |
申请号 |
EP19940401196 |
申请日期 |
1994.05.31 |
申请人 |
SONY CORPORATION |
发明人 |
IJUIN, KENICHI, C/O SONY CORPORATION |
分类号 |
B23P21/00;H05K13/04;(IPC1-7):H05K13/04 |
主分类号 |
B23P21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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