发明名称 |
LONG-TERM PACKAGING FOR THE PROTECTION OF IMPLANT ELECTRONICS |
摘要 |
The present invention provides a micropackaged device comprising: a substrate for securing a device; a corrosion barrier affixed to said substrate; optionally at least one feedthrough disposed in said substrate to permit at least one input and or at least one output line into said micropackaged device; and an encapsulation material layer configured to encapsulate the micropackaged device. |
申请公布号 |
EP3030212(A1) |
申请公布日期 |
2016.06.15 |
申请号 |
EP20140834336 |
申请日期 |
2014.03.25 |
申请人 |
CALIFORNIA INSTITUTE OF TECHNOLOGY |
发明人 |
TAI, YU-CHONG;CHANG, HAN-CHIEH |
分类号 |
A61J1/00;A61B90/00;A61F2/14;B65D85/86;B65D85/90 |
主分类号 |
A61J1/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|