Gefüge aus einem Träger und einem Halbleiterkörper und Verfahren zum Herstellen desselben.

摘要

The invention relates to the combination of a support (3) and a semiconductor body (1) and to a method of manufacturing same, in which a deformable metal layer (2) is disposed between the semiconductor body and the support. The semiconductor body is connected to the support by pressing the semiconductor body and the support against each other under pressure after heating the metal layer. The semiconductor body is then provided at its surface facing the support with at least one projecting part (4), which is embedded in the metal layer.