| 摘要 |
PURPOSE:To obtain a heat dissipation member, which never deforms resin parts and can be increased its holding properties by the resin parts, and a semiconductor package using this heat dissipation member. CONSTITUTION:A heat dissipation member 10 consists of a flat plate-shaped heat dissipation part 11 having an area larger than that of a semiconductor element 6 and extension parts 12 to extent in a parallel form from each side of the heat dissipation part 11 outward of the interior of a package. The surface on one side of the surfaces of the part 11 is brought into contact to the rear of the element 6, the other surface of the part 11 is made to expose to the outer surface of the package and at the same time, the parts 12 are completely covered with each resin part 17. The direction of shrinkage of a resin subsequent to a resin molding is dispersed to the sides of both surfaces of each extension part 12 and the deformation to one direction of each resin part 17 is prevented from being generated. As the parts 12 are respectively covered completely with each resin part 17, the holding properties of the member 10 are increased by the resin parts 17. A plurality of notch holes 14 for increasing the fluidity of the resin are respectively provided in the extension parts 12. |
