| 摘要 |
The photosensitive resin composition of the present invention comprises an admixture of 5 to 100 weight parts of a photosensitive material having the following general formula (A) and 100 weight parts of an alkali-soluble resin: General formula (A) sents a hydrogen atom, a hydroxyl group, a halogen atom, an alkyl group, an alkoxyl group, an aralkyl group, an aryl group, an amino group, a monoalkylamino group, a dialkylamino group, an acylamino group, an alkylcarbamoyl group, an arylcarbamoyl group, an alkylsulfamoyl group, an arylsulfamoyl group, a carboxyl group, a cyano group, a nitro group, an acyl group, an alkyloxycarbonyl group, an aryloxycarbonyl group, an acyloxy group, or -OD, -N(R)-D (where R represents a hydrogen atom or an alkyl group, and D represents a 1,2-napthoquinoediazide-5-sulfonyl group or a 1,2-napthoquinoediazide-4-sulfonyl group), and at least one of R1 to R8 represents -OD or -N(R)-D; R9 to R12 each independently represents a hydrogen atom, a lower alkyl group, or R9 and R10 and/or R11 and R12 may form a ring; R13 to R14 each independently represents a hydrogen atom, a lower alkyl group, or R13 or R14 and any of R15 or R16 may form a ring, whereas at least one of R13 to R16 is a substitution group other than hydrogen; and Z represents an oxygen atom or a single bond.
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