发明名称 |
METAL DEFUSING SYSTEM FOR OHMIC CONTACT |
摘要 |
The metal diffusion system can obtain better conditioned (regularity, symmetricity) annealing than the conventional soldering and anneal simultaneously a multiple of semicondustors based on the area of a heater. The system comprises an annealing furnace (20); a vacuum pump (30) for evacuating the annealing furnace (20); a temp. control means (40) controlling the temp. of the furnace (20): a halogen lamp (9) generating heat: a heater (6) transferring the heat from the halogen lamp (9); a mica plate (10) making the semiconductor (2) separate from the heater (6).
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申请公布号 |
KR940010152(B1) |
申请公布日期 |
1994.10.22 |
申请号 |
KR19910007616 |
申请日期 |
1991.05.11 |
申请人 |
HYUNDAI ELECTRONICS CO., LTD. |
发明人 |
KIM, TAE - JIN;CHAE, TAE - IL;LEE, DU - HWAN |
分类号 |
H01L21/28;(IPC1-7):H01L21/28 |
主分类号 |
H01L21/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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