| 摘要 |
<p>PURPOSE:To uniformize surface pressure by molding without being bridged the insulator part of a premolded insulator in which an insulator part and a semiconductor part are molded in one body and then applying an organic peroxide to the surface of the insulator and bridging only the surface part of the insulator part by pressing and heating. CONSTITUTION:A rubber mixture in which a bridging agent is not mixed is used for an insulator part 1, and a rubber mixture in which a bridging agent is mixed is used for a semiconductor part 2, and both of them are molded in one body in advance by a die. After that, an organic peroxide by itself or a mixture of the organic peroxide and bridging auxiliaries is applied to the surface of the insulator part 1 or impregnated thereinto, and once again set within the die, and only the surface of the insulator is bridged by a high temperature and a high pressure. For the organic peroxide, dialkyl peroxide and the like are enumerated, and the ratio of the organic peroxide to the bridging auxiliaries is preferably between 100:0 and 30:70 by weight. The insulator part 1 is made up of an unbridged part 1a within the inner part and the bridged part 1b of the surface layer, and the unbridged part 1a is made of an insulating rubber having the hardness of 0 to 10, and the bridged part 1b is made of a bridged insulating rubber having the hardness of 30 to 40.</p> |
