| 摘要 |
A wire bonding apparatus for semiconductor devices has a supporting block for holding a workpiece to which wires are bonded, a drive for driving the supporting block for holding the workpiece, the drive being capable of vertically moving and stopping the supporting block at a predetermined position, an optical means disposed above the supporting block and used for recognizing the pattern of the workpiece held on the supporting block, a storage means for prestoring each level of the workpiece so that the positions of not less than two places intended for recognition on the workpiece having difference in level conforms to the focal point of the optical means, and a control unit for controlling the drive for driving the supporting block, moving the workpiece to the position stored in the storage means and stopping the workpiece at that position. The supporting block is supported by a stroke bearing comprising a fixed part and a moving part which is moved and guided in the direction perpendicular to the fixed part. The drive for driving the supporting block comprises a cam shaft, a drive cam secured onto the cam shaft and generating a uniform velocity cam curve, a cam follower for coming contact with the drive cam, the cam follower being provided on the supporting block side, and a cam-driving pulse motor capable of rotating the cam shaft and electrically controlling the angle of rotation of the drive cam.
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