| 摘要 |
PURPOSE:To manufacture a microminiature hollow structure semiconductor device of round package at low cost. CONSTITUTION:The inner lead parts 7a and 7b of a lead frame are arranged opposing to each side of the four sides of a square-shaped semiconductor chip 13 to be arranged on the upper surface of an almost cylindrical-shaped substrate 8, and at the same time, the above-mentioned substrate 8 is coated by press- inserting with a cylindrical shaped plastic lid. As a result, the upper and the lower surfaces of a semiconductor device is made small in area, and a round package of microminiature hollow structure can be formed at low cost. As the external shape of the semiconductor device is the so-called round shape, it is suitable for application to a micromiature electronic endoscope and the like. |
