发明名称 Polyacetal resin composition having high-temperature stiffness
摘要 An engineering polyacetal resin composition comprising 0.05-20 parts by weight of a dispersant (B) and 5-40 parts by weight of a filler (C), and 100 parts by weight of a resin ingredient (A) which comprises 90-50% by weight of a polyacetal resin (a) and 10-50% by weight of a polyamide resin (b) having a melting point of up to 230 DEG C., a maximum particle diameter of 0.03-10 mu m and a maximum aspect ratio of up to 2, and is dispersed in a matrix of said polyacetal resin (a).
申请公布号 US5354798(A) 申请公布日期 1994.10.11
申请号 US19910746341 申请日期 1991.08.16
申请人 ASAHI KASEI KOGYO KABUSHIKI KAISHA 发明人 TSUKAHARA, HIROSHI;NIINO, MASAHIKO
分类号 C08K5/21;C08G18/40;C08K5/16;C08K5/205;C08K5/31;C08K5/3477;C08L59/00;C08L59/02;C08L61/20;C08L77/00;(IPC1-7):C08L67/00 主分类号 C08K5/21
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