发明名称 Molding materials and molded products thereform
摘要 A molding material is disclosed, comprising a film (A) coated on one surface with a thermosetting resin composition containing a hollow filler, a film (B) on which no resin composition is applied, and a reinforcing fiber layer positioned between the coated surface of film (A) and film (B), wherein the reinforcing fiber layer is impregnated with the liquid component of the resin composition coated on film (A). A piled material is also disclosed, comprising the two portions of the said molding material, wherein the respective molding materials are positioned on top of the other portion in a face-to-face relationship having their respective film (A) sides facing inwardly to each other, where the respective films (A) have been stripped off prior to positioning. A molded product prepared by curing the said piled material from which the films (B) have been stipped off prior to curing, under heating and compressing conditions are very useful for preparing a structural member which is lightweight and has high mechanical strength, due to its lower specific gravity and higher mechanical strength.
申请公布号 US5354585(A) 申请公布日期 1994.10.11
申请号 US19920834822 申请日期 1992.02.13
申请人 TAKEDA CHEMICAL INDUSTRIES, LTD. 发明人 SHIBATA, TAKASHI;AKIYAMA, KOICHI;ASAO, SHINICHIRO
分类号 B29C70/02;B32B27/12;(IPC1-7):B32B5/18;B32B5/16 主分类号 B29C70/02
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