| 摘要 |
<p>PURPOSE:To provide a circuit board and its treating method shield effect is improved and a highly reliable circuit device is realized. CONSTITUTION:Circuit patterns 4, 6 are formed by printing and burning a conductor layer 10 in a circuit board 2. After a dielectric layer 12 is formed on the circuit pattern, a shield conductor layer 14 covering the circuit pattern selectively is formed. After an overcoat process (an overcoat glass layer 16) having anti-plating solution property is performed selectively for a circuit pattern which is not covered with the shield conductor layer and the overcoat process is performed for the surface of a shield conductor layer, a plating conductor layer is formed in the circuit pattern which is exposed from an overcoat by electroless plating.</p> |
