LEAD FRAME

摘要

PURPOSE:To provide a lead frame having such a new constitution that the number of pins can be increased without raising the manufacturing cost and deteriorating the characteristics and the size of the lead frame can be reduced. CONSTITUTION:The lead frame can be used for semiconductor devices constituted by using glass ceramic sealing type packages and is provided with an annular extension wiring layer 7 having a hole through which integrated circuit chips mounted on a ceramic base can be passed without making the chips to come into contact with the internal surface of the hole, trunk wiring layers 7 which are mounted on the trunk wiring board with insulating layers 6 in between and have prescribed patterns, and lead pins 3 the inner lead sections of which are directly connected to the layers 7.