| 摘要 |
<p>PURPOSE:To provide a semiconductor chip picking-up device, which is capable of picking up reliably a semiconductor chip on an expanded tape without causing the positional deviation of the chip and at the same time, is contrived its simplification, and a method of picking up the semiconductor chip. CONSTITUTION:A pickup needle 9, which is arranged in a tape guide 5 with a vacuum hole 8 formed in a guide surface 6, is formed in such a way that the height of the upper end of the needle 9 coincides roughly with the guide surface 6 to fix relatively to a tape guide 5 main body, while the size of the hole 8 is set sufficiently large to that of a semiconductor chip to be picked up. Moreover, a vacuum pressure to be made to act on this hole 8 is set in such a way that when this vacuum pressure is made to act, an expanded tape covering the hole 8 is pulled in the hole 8 into a recessed form.</p> |
