| 摘要 |
PURPOSE:To improve the heat dissipation property of a semiconductor device provided with heat dissipation fins for cooling a semiconductor element in a package, in which the element is sealed and which is made of a resin, integrally with the package made of resin as well as to prevent separation of the element due to the thermal expansion of a material or the like from being generated. CONSTITUTION:In a semiconductor device 4, a resin bonding agent is applied on the surface, which is previously mounted with a semiconductor element, of a lead frame and after the bonding agent is semicured, a package 5 and heat dissipation fins 6 are molded or the fins 6 are formed of a resin composition containing a specified epoxy resin, a curing material, a filling material, a flexibility imparting agent and a curing catalyst. |
