Verfahren zum Mikroverkapseln, damit hergestellte mikroelektronische Apparate und wärmehärtbare Zusammensetzungen.
摘要
A method for encapsulating microelectronic devices is provided using a heat curable epoxy composition having a monomeric or polymeric diaryliodonium hexafluoroantimonate salt. Curable compositions are also provided as well as encapsulated microelectronic devices.
申请公布号
DE3851194(D1)
申请公布日期
1994.09.29
申请号
DE19883851194
申请日期
1988.09.24
申请人
GENERAL ELECTRIC CO., SCHENECTADY, N.Y., US
发明人
WALLES, ERIK WILHELM, RENSSELAER NEW YORK 12144, US;CRIVELLO, JAMES VINCENT, CLIFTON PARK NEW YORK 12065, US;LUPINSKI, JOHN HENRY, SCOTIA NEW YORK 12302, US
