| 摘要 |
The invention relates to a method for producing a vacuum-tight connection of two ceramic parts (1 and 2) or one metal and one ceramic part (2 and 4) of an electron tube. Provision is made in this case for an inorganic, non-metal solder to be brought between the two parts (1 and 2, 2 and 4) to be connected and for the parts (1 and 2, 2 and 4) to be connected, together with the solder, to be heated to such a temperature that an intermediate layer (3, 5) of the solder is formed which connects the parts (1 and 2, 2 and 4). <IMAGE>
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| 申请人 |
SIEMENS AG, 80333 MUENCHEN, DE |
发明人 |
ROESEL, ROLAND, DIPL.-ING., 2070 AHRENSBURG, DE;EBERHARDT, RAMONA, DR.RER.NAT., O-6901 OSMARITZ, DE;PALIEGE, ANGELA, DIPL.-ING., 5620 VELBERT, DE;SCHNAPP, JUERGEN, DR.-ING. HABIL., O-6902 JENA, DE;KEIL, DIETRICH, DR.RER.NAT., O-6820 RUDOLSTADT, DE |
