| 摘要 |
PURPOSE:To enable a semiconductor chip to be mounted on printed conductors by arranging terminals for external connections on one side of the chip. CONSTITUTION:A semiconductor chip 140, having terminals 142 and 144 on only one side, is bonded to a substrate 100 with adhesive 160. The chip is on printed conductors 110 of the substrate, and its terminals 142 and 144 are close to bonding pads 120 on the substrate. The input/output terminals 142 of the chip are connected to the bonding pads 120 by wire 180. A substrate 200 for a driver circuit has terminals 210 connected through wire 220 to bonding pads 124, which are connected with driver terminals 144 of the chip 140. The printed conductors 110 are connected to a heater of an image sensor. |
