| 摘要 |
<p>PURPOSE:To provide a manufacturing method of an excellent semiconductor device wherein each element is mounted on a previously flattened insulative film, insulative resin is buried, and a wiring pattern is collectively formed from above the insulating film. CONSTITUTION:In a manufacturing method of a semiconductor device wherein mounting components different in height are collectively wired and connected, the mounting components 1, 2 different in height are collectively mounted on a flattened insulating film 4 in the manner in which the wiring surfaces face the film 4, insulating resin 3 is buried in the part between the components and cured to fix the components, trenches 8 corresponding with a wiring pattern are formed on the insulative film 4, conductor material is buried in the trenches 8 to constitute a wiring pattern, and, at the same time, the mounting components 1, 2 are connected with bonding pads 6.</p> |
