发明名称 MANUFACTURE OF PRINTED-WIRING BOARD
摘要 PURPOSE:To provide the manufacturing method, of a printed-wiring board, wherein it can form a continuity hole in the board wish good accuracy and its productivity is high. CONSTITUTION:Parts in which a continuity hole is to be formed in metal thin- film layers 4, 5 formed on both faces of a board 1 formed in such a way that a glass cloth 2 has been impregnated with a resin 3 and hardened are removed. Then, the resin 3 on the board is removed by an atmospheric-pressure glow plasma etching operation 6, a hole is worked, a plating operation 7 is executed to the formed hole, and the continuity hole 8 is formed.
申请公布号 JPH06244528(A) 申请公布日期 1994.09.02
申请号 JP19930054774 申请日期 1993.02.19
申请人 TOPPAN PRINTING CO LTD 发明人 TSUKAMOTO TAKETO;OFUSA TOSHIO;TOKI SOTARO
分类号 H05K3/00;H05K3/42;H05K3/46;(IPC1-7):H05K3/00 主分类号 H05K3/00
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