| 摘要 |
Disclosed is an improvement in a process for fabricating flexible electronic circuitry, which improvement comprises the use as a laminating adhesive of an aqueous dispersion composition of a water-insoluble latex polymer, prepared by the process which comprises: (a) preparing by emulsion polymerization an initial aqueous dispersion of an initial waterinsoluble latex polymer of at least one ethylenically unsaturated monomer, wherein said ethylenically unsaturated monomer comprises no more than about two percent by weight, based on the total weight of said ethylenically unsaturated monomer, of multi-alpha, betaethylenically unsaturated monomer and wherein said initial water-insoluble latex polymer otherwise contains essentially no sites of ethylenic unsaturation, (b) dispersing in said initial aqueous dispersion of initial water-insoluble latex polymer additional ethylenically unsaturated monomer comprising at least one monomer having at least two sites of alpha, beta-ethylenic unsaturation, whereby said additional monomer swells said initial latex polymer, and (e) polymerizing said additional monomer within said monomer swollen initial latex polymer to form said modified water-insoluble latex polymer.
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