发明名称 Method and apparatus for measuring the topography of a semiconductor device
摘要 The topography of a surface is measured by utilizing a probe (10, 20) having a variable flexibility and a conductive tip (14, 16). Using the conductive tip (14, 16), a first tunneling current is measured at a first point (36). The tip (14, 16) is moved to a second point (37) and a deflection force is measured. The measurements from the different points (36, 37, 38, 39, 40, 41) are combined to provide composite images of the surface's topography and material composition.
申请公布号 US5338932(A) 申请公布日期 1994.08.16
申请号 US19930000168 申请日期 1993.01.04
申请人 MOTOROLA, INC. 发明人 THEODORE, N. DAVID;CARREJO, JUAN P.
分类号 G01Q70/08;G01Q60/04;H01J37/00;(IPC1-7):H01J37/00 主分类号 G01Q70/08
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