SEMICONDUCTOR DEVICE AND MANUFACTURE THEREOF

摘要

PURPOSE:To ensure high accuracy of alignment between inner lead end portion and a pad to prevent generation of non-contact portions and damages on the pad. CONSTITUTION:The surface of a lead frame of inner lead 11 in the side of a semiconductor chip 2 is half-etched and the half-etched portion 12 is thermally bonded for temporary deposition with a semiconductor chip 2 through a both- side adhesive tape 6. In this case, the half-etched portion 12 is formed in the depth larger than the thickness of both-side adhesive tape 6. After this temporary deposition, a pad 4 of the semiconductor chip 2 is connected with the inner lead end part 13, for example, with electrical plating or the like.