| 摘要 |
PURPOSE:To provide an inspection apparatus which automatically inspects the connection state of a bonding wire connected to a semiconductor pellet with respect to a lead frame after wire bonding is completed. CONSTITUTION:With an air gushing nozzle 7 tilting a nozzle tip 7a obliquely downward and holding it with freedom of rotation and a pneumatic device 10 which feeds high-pressure air to the air gushing nozzle 7, an apparatus comprises a wire peeler 1 which gushes air by rotating the air gushing nozzle 7 from the center of a semiconductor pellet 5 toward a bonding wire 6 in the vicinity and a connection 13 with the bonding wire 6, and an image-taking device 2 which takes a picture of the surface of the semiconductor pellet 5. Then, a wire with a connection fault on the semiconductor pellet 5 side is separated forcibly by the wire peeler 1, and the image-taking device 2 takes a picture of the surface of the semiconductor pellet 5 for judgment of the quality of connection. |
