METHOD FOR PACKAGING ELECTRONIC COMPONENT

摘要

PURPOSE:To improve productivity of circuit formation by settling loss time of a single had mounter during circuit formation and by making a plurality of heads undergo the steps of suction, recognition, and mounting in succession to package electronic components in the system of component mounting accompanying the component packaging technology. CONSTITUTION:A head 8 can move within a plane 9 by using a planar linear motor as the drive source and is tipped with a nozzle 10 which sucks electronic components. A supplier 11 has electronic components set up so that a next component can be fed when a component is sucked by the nozzle 10. A sucked component is recognized, corrected in position, and the like by a camera 12 and then mounted on a printed board 13.