发明名称 SEMICONDUCTOR MAIN BODY PROCESSING
摘要 <p>PURPOSE: To use solvent which is less noxious for human and environment than nonpolar solvents for removing adhesive. CONSTITUTION: When a semiconductor body 1 is treated, another member 2 is sticked to the semiconductor body by adhesive 3, it is treated, the semiconductor body 1 is removed from another member 2 and the adhesive 3 is removed from the semiconductor body. An adhesive which is a mixture of one kind of carbohydrate or a plurality of kinds of carbohydrate is used.</p>
申请公布号 JPH06216223(A) 申请公布日期 1994.08.05
申请号 JP19930215691 申请日期 1993.08.31
申请人 PHILIPS ELECTRON NV 发明人 PETERU YOHAN EDEYUARUDO SUHERUWARUDO
分类号 H01L21/304;H01L21/301;H01L21/68;H01L21/683;H01L21/78;(IPC1-7):H01L21/68 主分类号 H01L21/304
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