CERAMIC MULTILAYERED WIRING BOARD

摘要

PURPOSE:To provide a ceramics multilayered wiring board which reduces the conducting resistance in a through-hole part and generates no crack while a ceramics board is baked. CONSTITUTION:A green sheet having through-holes is provided with a wiring pattern, and then the green sheets are piled up and baked to form a ceramics multilayered wiring board. The through-holes in the surface layer and in the board surfacial part within a second layer just under the surface layer in the ceramics multilayered wiring board are filled with a filling substance consisting of a mixed substance of 80-90wt.% metallic conductor and 10-20wt.% ceramics, while the through-holes in the inner layer part of the board excluding the board surfacial part are filled with a filling substance consicting a metallic conductor.