| 摘要 |
PURPOSE:To prevent a connection resin squeezed out on the periphery of a semiconductor chip from curing by using a mask at the time of light irradiation on the resin. CONSTITUTION:A mask provided with such a shielding part that light to be irradiated afterward is not irradiated on a connection resin 3 squeezed out on the periphery of a first semiconductor chip 4 is installed on the surface, whereon the chip is not installed, of a wiring board 1. After that, ultraviolet light 8, for example, is irradiated to cure the resin 3 of the chip 4, to fix the chip 4 on the board 1 and at the same time, to connect electrically bump electrodes 5 of the chip 4 with conductor wirings 2. At this time, the resin 3 squeezed out on the periphery of the chip, 4 is not cured because the light is shielded by the mask 7. Thereby, the semiconductor element adjacent to the board can be connected to the wiring board at a narrow interval. |
