DICING TAPE FOR SEMICONDUCTOR WAFER AND SEPARATING METHOD FOR CHIP,申请号JP19930003036-传众专利搜索

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发明名称	DICING TAPE FOR SEMICONDUCTOR WAFER AND SEPARATING METHOD FOR CHIP
摘要
申请公布号	JPH06209042(A)	申请公布日期	1994.07.26
申请号	JP19930003036	申请日期	1993.01.12
申请人	MITSUBISHI ELECTRIC CORP	发明人	GOTO KEI
分类号	H01L21/301;H01L21/78;(IPC1-7):H01L21/78	主分类号	H01L21/301
代理机构		代理人
主权项
地址

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