| 摘要 |
PURPOSE:To increase the capacity of a semiconductor integrated circuit as compared with the conventional semiconductor integrated circuit by providing an insulator between an upper and lower silicon chips and connecting the chips with each other through lead wires. CONSTITUTION:A lower silicon chip 4 is fixed on a mounting plate 5 and an upper silicon chip 2 is fixed on an insulator 3. The chips 2 and 4 are connected to each other through lead wires 6 and, at the same time, the chip 2 is connected to lead legs 7 through lead wires 6. The chip 2 is formed so that the chip 2 can become a little shorter than the length of the insulator 3. After connecting the chips 2 and 4 to each other and connecting the chip 2 to the lead legs 7 in such a way, a cap 8 is fitted. Thus a semiconductor integrated circuit having a capacity larger than that of the ultra LSI can be obtained.
|
