| 摘要 |
PURPOSE:To simply and surely detect the open defect of a solder joint part between the lead wire of an electronic part and a wiring pattern on a substrate in a circuit substrate mounted with a plurality of resin package type electronic parts. CONSTITUTION:An electronic part 1 has such characteristics, in the shape of the electronic component having a lead 3 extending from the side of a resin package 2, as a part of the upper face of the inner lead part 3b of the lead 3 is exposed inward from the side edge of a resin package 2. In the case of the inspection of the defect of connection between the lead 3 and a wiring pattern 8 on a substrate 4, measuring probes 11, 11 are severally put between the exposedly shaped inner lead part 3b of the lead 3 and the pattern 8 on the substrate to be connected with the lead 3, and the defect of connection can be easily and surely inspected by carrying electric current between the probes 11, 11. |
