发明名称 SEMICONDUCTOR DEVICE
摘要 PURPOSE:To prevent sealing resin from separating from a semiconductor device sealed up with epoxy resin so as to improve the device in moisture resistance. CONSTITUTION:A milled filler-loaded polyimide film l is provided onto a cover film 2 which covers a semiconductor pellet 3, and the whole semiconductor pellet 3 is sealed up with epoxy resin 6. By this setup, a milled filler-loaded polyimide film 1 provided with a saw-toothed rough surface is formed on the semiconductor pellet 3, so that the film 1 is enlarged in contact area with polyimide resin and enhanced in adhesion to it, and as stress is dispersed by the saw- toothed rough surface of the film 1, a semiconductor device sealed up with epoxy resin is protected against cracking and enhanced in moisture resistance.
申请公布号 JPH06204362(A) 申请公布日期 1994.07.22
申请号 JP19930000166 申请日期 1993.01.05
申请人 NEC CORP 发明人 ITO KATSUMI
分类号 H01L23/29;H01L23/31;H01L23/50 主分类号 H01L23/29
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