摘要 |
PURPOSE:To prevent sealing resin from separating from a semiconductor device sealed up with epoxy resin so as to improve the device in moisture resistance. CONSTITUTION:A milled filler-loaded polyimide film l is provided onto a cover film 2 which covers a semiconductor pellet 3, and the whole semiconductor pellet 3 is sealed up with epoxy resin 6. By this setup, a milled filler-loaded polyimide film 1 provided with a saw-toothed rough surface is formed on the semiconductor pellet 3, so that the film 1 is enlarged in contact area with polyimide resin and enhanced in adhesion to it, and as stress is dispersed by the saw- toothed rough surface of the film 1, a semiconductor device sealed up with epoxy resin is protected against cracking and enhanced in moisture resistance. |