发明名称 MULTILAYER PRINTED-WIRING BOARD
摘要 <p>PURPOSE:To restrain a warp from being caused even when individual layers for a multilayer printed-wiring board are formed to be respectively proper thicknesses. CONSTITUTION:An insulating reinforcement layer 2 is laminated at least on one surface of a multilayer printed-wring board 1. In order to enhance an electric characteristic, individual layers for the multilayer printed-wiring board 1 are formed to be respectively proper thicknesses. Even when the constitution of the layers is made asymmetric in their thickness direction, it can be corrected so as to obtain the symmetry of the layers by the insulating reinforcement layer 2, and it is possible to restrain a warp from being caused as far as possible.</p>
申请公布号 JPH06196861(A) 申请公布日期 1994.07.15
申请号 JP19920342301 申请日期 1992.12.22
申请人 MATSUSHITA ELECTRIC WORKS LTD 发明人 KANO TAKESHI;ISHIKAWA MASAHARU
分类号 H01L23/12;H05K3/46;(IPC1-7):H05K3/46 主分类号 H01L23/12
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