| 摘要 |
<p>PURPOSE:To reduce a problem (a break) when an electronic component is mounted on an inner-layer circuit board by a method wherein the number of components mounted on an outer layer in a multilayer circuit board is reduced and a high-density wiring operation is performed easily. CONSTITUTION:An electronic component 2 is reflow-soldered and mounted on an inner-layer circuit board 1 to which a prescribed circuit has been worked. A thermoset resin layer 3 whose thickness is uniform is formed on the surface of the inner-layer circuit board 1 in such a way that the electronic component 2 is covered. A prescribed number of prepregs 4 are piled up on the surface of the thermoset resin layer 3, an outer-layer circuit material 5 (a copper foil) is placed on them, and they are thermally pressurized, molded and multilayer- bonded.</p> |
