| 摘要 |
PURPOSE:To prevent cracking of glass due to thermal effect at the joint of an enclosure base and a cap by providing a specific enclosure base, a lead frame being jointed through a low melting point glass, etc., thereby jointing the lead frame rigidly to the enclosure base. CONSTITUTION:The semiconductor device comprises an enclosure base 1 composed of aluminium nitride ceramic, and a lead frame 4 jointed to the enclosure base 1 through low melting point glasses 5, 10. The semiconductor device further comprises a semiconductor element 7 secured to the enclosure base 1 and connected electrically with the lead frame 4, and a cap 3 jointed to the enclosure base 1 including the lead frame 4 through the low melting point glasses 5, 10 and externally shielding the semiconductor element 7. Since the lead frame 4 can be jointed rigidly to the enclosure base 1, exfoliation of the lead frame 4 can be prevented during various steps when the semiconductor element 7 is mounted on the enclosure base 1. |
