| 摘要 |
PURPOSE:To provide the assembly structure, of a pressure sensor, which makes the mounting posture and the positioning of a semiconductor pressure sensor element incorporated in a resin case proper and enhances the quality of the pressure sensor. CONSTITUTION:In a semiconductor pressure sensor, a resin case 3, a lid 6 applied to the upper face of the case 3, a lead terminal row 4 molded integrally with the resin case 3, a glass pedestal 2 which is accommodated in, and fixed to, a bottom-side recessed part 3 inside the case 3, a semiconductor pressure sensor element 1 mounted on the pedestal 2 and bonding wires connecting the pressure sensor element 1 to the lead terminal row 4 are assembled and constituted as main parts. In the semiconductor pressure sensor, a protruding part 3b which carries and holds the glass pedestal 2 is formed on the bottom of the recessed part 3a in the resin case 3. Then, the protruding part 3b is used as a reference level, an adhesive 8 (a self-adhesive silicone adhesive provided with rubber elasticity in a hardened state) is filled into the recessed part 3a and the glass pedestal 2 is bonded and fixed to a definite position. |
