| 摘要 |
PURPOSE:To provide an electronic control multichip power module having a small size and a low cost. CONSTITUTION:A signal system board and a power system board of a power module are formed of separate upper and lower boards. A power IC chip 307 is fixed to a heat sink 303 of the power system board. The signal system board is formed of a thin film board 301 disposed on the chip 307 and having front and rear electrodes 315b, 308b. A control IC chip 306 is disposed on the board 301. Bump electrodes 308a, 315a are respectively arranged on the chips 307 and 306. The electrodes 308a, 315a are respectively brought into contact with the electrodes 308b, 315b of the board 301, and hence electrically connected with the chips 307 and 306. |
