| 摘要 |
<p>PURPOSE:To obtain a multilayer printed-wiring board provided with an outer copper foil excellent in surface properties by a method wherein an eyelet flange smaller than a specific value in thickness is used, and the outer copper foil coming into contact with the flange of an eyelet around a hole which is provided to an inner core material and where an eyelet is inserted is previously removed. CONSTITUTION:Prepreg 3 is interposed between inner core materials 1 and 2 where wiring patterns are formed, and another prepreg 3 and a copper foil 4 or the prepreg 3 and a one-sided copper-clad laminated board are provided to the outside of the inner core material 2, a laminate composed of the prepreg 3, the core materials 1 and 2, and the copper foil 4 is thermocompressed and formed into one piece. In this manufacturing process, the inner core materials 1 and 2 and the prepreg 3 interposed between the inner core materials 1 and 2 are previously fixed together with an eyelet 11 whose flange is below 0.2mm in thickness. It is preferable that the outer copper foil 4 coming into contact with the flange of the eyelet 11 around a hole where the eyelet 11 is inserted is previously removed.</p> |
