摘要 |
Automated bonding of chips (12) to tape and formation of bonding structures on Tape Automated Bonding (TAB) packaging structures are provided with bonding balls (38, 238, 338) on the ends of beam leads (13C, 81) of the TAB tape (10C). Also balltape bonding balls (9A, 9B) are aligned on stacked TAB sheets (26, 27) and bonded together to form via interconnections through stacked balltape balls in multilayer, electronic packging structures. Interconnection structures are provided for a universal chip connection laminate which can be applied between a chip (12) and a multilayered ceramic package (133). |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORP., ARMONK, N.Y. |
发明人 |
HODGSON, RODNEY TREVOR, OSSINING NEW YORK 10562;JONES, HARRY JORDAN, AUSTIN TEXAS 78731;LEDERMANN, PETER GERARD, PLEASANTVILLE NEW YORK 10570;REILEY, TIMOTHY CLARK, RIDGEFIELD CONNECTICUT 06877;MOSKOWITZ, PAUL ANDREW, YORKTOWN HEIGHTS NEW YORK |